Global and China Advanced Packaging Industry Report, 2009-2010

and Gross Profit of Unisem, 2004-2010
Revenue and Operating Margin of Nantong Fujitsu Microelectronics
Co., Ltd., 2006-2011
Revenue of Nantong Fujitsu Microelectronics Co., Ltd. by Package
Type, 2009
Revenue and Gross Margin of Chipbond, 2003-2011
Revenue of Chipbond by Package Type, 2010Q2
Revenue of Chipbond by Client, 2010

Application of IC for Common Mobile Phone WLCSP Packaging, 2010
Revenue, Gross Margin, and Operating Margin of Global Top 20
Packaging & Test Companies, 2009-2010
Revenue and Growth Margin of Global Top 20 Packaging & Test
Companies, 2009-2010
Package Type of Major Mobile Phone Components, 2000-2015
Packaging Technology Development of Global Major Mobile Phone
Baseband Vendors, 2008-2013E
19 Types of Typical Mobile Phone Baseband Packaging
Global Typical Mobile Phone Application Processor Packaging
Technology, 2010
Packaging Details of 14 Typical Mobile Phone Transceivers
PA Packaging of 20 Typical Mobile Phones
Other IC Packaging Technologies of Typical Mobile Phones
Capacity of FATC
Acquisitions of ChipMOS
Capacity of SPIL, 2006Q1, 2007Q2&Q3, 2009Q1&Q2
Capacity of SPIL Suzhou
Copper Wire Bonding Proportion of