Global and China Advanced Packaging Industry Report, 2009-2010

Ltd. (FATC)
5.3 Powertech Technology Inc. (PTI)
5.4 ChipMOS TECHNOLOGIES (Bermuda) LTD. ("ChipMOS")
5.5 King Yuan Electronics Co., Ltd. (KYEC)
5.6 Amkor
5.7 Siliconware Precision Industries Co., Ltd. (SPIL)
5.8 STATS ChipPAC Ltd.
5.9 Advanced Semiconductor Engineering Inc. (ASE Inc.)
5.10 Kinsus Interconnect Technology Corp.
5.11 Nan Ya PCB Corporation
5.12 Unimicron
5.13 Camel Precision Co., Ltd.
5.14 IBIDEN
5.15 Shinko Electric Industries Co., Ltd.
5.16 Nepes
5.17 STS Semiconductor
5.18 SEMCO
5.19 Jiangsu Changjiang Electronics Technology Co., Ltd (JCET)
5.20 Unisem
5.21 CARSEM
5.22 Nantong Fujitsu Microelectronics Co., Ltd.
5.23 Chipbond Technology Corporation (Chipbond)

【Figures & Tables】

Development History of IC Packaging, 1980-2010
Sketch Map of SOP and TSSOP Profile & Transect
Sketch Map of QFP, LQFP, and HQFP Packaging Profile & Transect
Sketch Map of FBGA Profile & Transect
Development Roadmap of FBGA, 2006-2012
Sketch Map of TEBGA Profile & Transect
Sketch Map of FC-BGA Profile & Transect
Development Roadmap of FC-BGA, 2006-2012
Sketch Map of WL-CSP Profile, Manufacturing Process, and Transect
Development